|Vaša cena s DPH:||404.40 EUR|
|337.0000 EUR bez DPH|
YIHUA 1000A infrared soldering station
1. Using the newSAMSUNG microcomputer processor PIDprogrammable temperature control technology and uses an infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.
2. Adoptinfrared weld technologywhich independent exploration, infrared penetration strength, components uniform heating, beyond the traditional hot air heating vowed to prevent blow off the IC surrounding small components.
3.Technician focused infrared heatis easy to target most component removal/replacement and re-work.
4. Infrared heat source bulbs arelong-lived, un-expensive and easily replaced.
5. Has bright delicate,low voltage LED lighting, safety and energy conservation.
6.It hasExternal Sensor Temperature control mode, that is detected by the sensor IC surface temperature control temperature,this function is good for freshman operation ,it’s safe way protectcomponents .
7.MountTechnology (SMT) components 15-35cm in size.
8. This machine has 540W heating system , widely to 120mm*120mm.
9.Preheating plate color is black,from the photics point of view, black coloreasy to absorb heating, shorten the warm-up time.
10. Powerful human function design, with the following functions:
A.Temperature correction function Correction of temperature range:-50°C~+50 °C(Infrared lamp analog value 580).
B.Celsius / Fahrenheit temperature display function
11. This machine also hassoldering iron function, if you have the device ,you can used for all of the components solder ,desoldering ,preheating ,repair all components ,especially Micro BGA components.
Preheating station parts
TemperatureRange 50°C-300°C/122°F~572°F or 50 °C ~200 °C / 122°F~488°F
Come with 2 lens cup, you can be choice two of lens cup from 28mm / 38mm /48mm.
YIHUA 1000A Infrared BGA rework stationdisplay
Operation infraredBGA rework stationNOTICE
1.Repair circuit boards required precautions and necessary protective measures
1)To ensure that both sides of the circuit board preheat zone without fusible explosive flammable components,like Plastic,Display,Phone camera,LED,Electrolytic capacitors.
2)Ensure that no combustible fusible explosive components in Infrared light can shine on the area, If you can not avoid,Must use reflective paper keep out that. like Plastic,Display,Phone camera,LED,Electrolytic capacitors.
2.According to IC size, use a suitable diameter lamp cup(lamp cup size larger than IC size);Install lights Cup minimize the distance between lamp and IC,to facilitates heating.
3. Ensure that the working environment is no greater airflow to prevent heat loss,well sheltered measures when necessary.
4. Apply solder paste to the IC before the de-soldering,also you can early preheat then Apply solder paste,Especially BGA package IC,should be early preheat then apply solder paste,the can make solder paste penetrate into the bottom of the IC.
5.Wear heat protective gloves and goggles. Place the visor, good shading measures to protect the eyes.
6. Turn on the Infrared light power,set the temperature to about 280°C.Make the appropriate adjustments based on the size of the IC and circuit board. IC by infrared light irradiation will be rapidly warming (generally 1 to 3 minutes) .
7. Just started using this product, it is best to try to use the abandoned circuit board rework a few times. and so familiar with the use of this product ,then carry out normal maintenance work.
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|Posledná aktualizácia 04.12.2021.|